HEAT TRANSFER COMPOUND - SILICONE (860-1P)

Description:High thermal conductivityHigh dielectric constantHigh dissipation factorUse with heat sinks or metal chassisWill not dry or hardenContains zincs oxides and polydimenthyl siloxaneNon-silicone version availableDesigned for use in transferring heat away from electrical and electronic devices such as; transistors; power diodes; semi-conductors; ballast's and thermocouple wells. High thermal conductivity; high dielectric constant; high dissipation factor; use with heat sinks or metal chassis; will not dry or harden. Contains zinc oxide and polydimethyl siloxane. 860-1PManufacturer:MG ChemicalsProduct Category:ChemicalsRoHS:CompliantProduct:Thermal ManagementType:Silicon Heat Transfer CompoundSize:2.5 lbsFactory Pack Quantity:1Unit Weight:3 lbs