HEAT TRANSFER COMPOUND - SILICONE (860-4G)

Description:High thermal conductivity High dielectric constant High dissipation factor Use with heat sinks or metal chassis Will not dry or harden Contains zincs oxides and polydimenthyl siloxane Non-silicone version available Designed for use in transferring heat away from electrical and electronic devices such as; transistors; power diodes; semi-conductors; ballast's and thermocouple wells. High thermal conductivity; high dielectric constant; high dissipation factor; use with heat sinks or metal chassis; will not dry or harden. Contains zinc oxide and polydimethyl siloxane. 860-4GManufacturer:MG ChemicalsProduct Category:ChemicalsRoHS:CompliantProduct:Thermal ManagementType:Silicon Heat Transfer CompoundSize:4 gFactory Pack Quantity:100Unit Weight:1 lb